The impact of embedded wafer level BGA package on the antenna hemispherical lens characterization for wireless applications at 61 GHz - Pour Mousavi, Seyed Mehran; Wojnowski, Maciej; Roehr, S.; Sommer, Grit; Weigel, Robert (European Conference of Antennas and Propagation (EuCAP), 2013)
elib2cris::1512001600,pourmousavi2013