Rohde & Schwarz GmbH & Co. KG

Investigation of a Simple and Versatile Concept for OFDM Radar Target Simulator Enhancement (2024) Birkenhauer C, Körner G, Stief P, Hamberger G, Beer M, Carlowitz C, Vossiek M Conference contribution, Conference Contribution A MIMO ISAR Approach with Depth Camera Motion Tracking for Improved Imaging in Walk-Through Security Scanners (2023) Root K, Gumbmann F, Adametz J, Ullmann I, Vossiek M Conference contribution A Simple and Versatile Concept to Improve Dynamic Range and Enable Target Angle Adaptability in Radar Target Simulators (2023) Birkenhauer C, Körner G, Stief P, Hamberger G, Beer M, Carlowitz C, Vossiek M Journal article A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Conference contribution An Ultra-Wideband DC-Block on Thin-Film Ceramic for the Next Generation of Test and Measurement Applications Up to 150 GHz (2023) Scheder A, Pfahler T, Bridier A, Schür J, Vossiek M Conference contribution A Modular MIMO Millimeter-Wave Imaging Radar System for Space Applications and Its Components (2020) Hrobak M, Thurn K, Moll J, Hossain M, Shrestha A, Thualfiqar AS, Stoppel D, et al. Journal article, Review article Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications - A method to combine low tolerances and low prices on standard pcb substrates (2017) Röhrl FX, Sammer R, Jakob J, Bogner W, Weigel R, Hassel U, Zorn S Conference contribution, Conference Contribution An improved ultra-low-phase noise tunable YIG oscillator operating in the 6–12 GHz range (2017) Stein W, Huber F, Bildik S, Aigle M, Vossiek M Conference contribution, Conference Contribution A monolithically integrated, optically clocked 10 GS/s sampler with a bandwidth of >30 GHz and a jitter of <30 fs in photonic SiGe BiCMOS technology (2017) Krueger B, Makon RE, Landolt O, Hidri O, Schweiger T, Krune E, Knoll D, et al. Conference contribution Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package (2016) Röhrl FX, Bogner W, Jakob J, Hageneder D, Zorn S Conference contribution